IEEE - Institute of Electrical and Electronics Engineers, Inc. - Failure analysis of Sn-3.5Ag solder joints for FCOB using 2-D FEA model

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Dongliang Wang ; Yuan Yuan ; Le Luo
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 624 - 629
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5583882
Regular:

The test vehicle is the FCOB with the chip size of 4mm*4mm*0.52mm, 0.32mm pitch and an I/O array of 13*13. Different solder height and UBM height are considered. The analysis is performed by a 2-D... View More

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