IEEE - Institute of Electrical and Electronics Engineers, Inc. - Deformation analysis of Multilayer Board in the lamination process

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Peng Xu ; Dan Deng ; Dong Liu ; Tuanfen Gao ; Fengshun Wu ; Longzao Zhou ; Weihong Peng
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 612 - 615
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5583808
Regular:

The deformation of core board affects the quality of circuit board, like misalignment, during lamination process of MLB (Multilayer Board). Three main factors causing the deformation are... View More

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