IEEE - Institute of Electrical and Electronics Engineers, Inc. - Signal integrity design and validation for multi-GHz differential channels in SiP packaging system with eye diagram parameters

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Wei Gao ; Lixi Wan ; Shuhua Liu ; Liqiang Cao ; Guidotti, D. ; Jun Li ; Zhihua Li ; Baoxia Li ; Yunyan Zhou ; Fengman Liu ; Qidong Wang ; Jian Song ; Haifei Xiang ; Jing Zhou ; Xu Zhang ; Feng Chen
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 607 - 611
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5583805
Regular:

Differential interconnect lines in multi-gigabits system in package (SiP) packaging system are studied in this paper. The performance of interconnect lines can be easily estimated with jitter and... View More

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