IEEE - Institute of Electrical and Electronics Engineers, Inc. - 12-channel board-level multi-GHz optical link using cross-switch chips and optoelectronic multi-chip package modules

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Fengman Liu ; Zhihua Li ; Wei Gao ; Haifei Xiang ; Jian Song ; Baoxia Li ; Lixi Wan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 587 - 589
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5583802
Regular:

High density, large bandwidth and lower power consumption link and switch inter-system is required. Short-distance parallel optical link has become the hotspot of research because of its advantage... View More

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