IEEE - Institute of Electrical and Electronics Engineers, Inc. - Prediction of package warpage combined experimental and simulation for four maps substrate

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Wu, R.W. ; Chen, C.K. ; Lung-Chuan Tsao
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 576 - 581
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5583800
Regular:

As electronic devices become lighter, thinner, shorter, and smaller, IC packages follow. Low-profile type packages are reduced in thickness, so the stiffness of thin type packages is weaker due to... View More

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