IEEE - Institute of Electrical and Electronics Engineers, Inc. - Dielectric property of nickel/calcium copper titanate/Polyvinylidene Fluoride composite

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Wenhu Yang ; Shuhui Yu ; Rong Sun ; Ruxu Du
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 460 - 463
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5583799
Regular:

This paper reports a nickel (100nm)/calcium copper titanate (1um)/ Polyvinylidene Fluoride three-phase composite prepared through a simple blending and hot-molding procedure. The microstructure... View More

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