IEEE - Institute of Electrical and Electronics Engineers, Inc. - Performance of silver-glue attachment technology in assembly

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Mu-Chun Wang ; Kuo-Shu Huang ; Zhen-Ying Hsieh ; Hsin-Chia Yang ; Chuan-Hsi Liu ; Chii-Ruey Lin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 472 - 475
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5583797
Regular:

Before the wire bonding or flip-chip package is executed, the die-attachment process must be implemented first. In this study, we observe that the quality, sticking process, epoxy-resin diffusion... View More

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