IEEE - Institute of Electrical and Electronics Engineers, Inc. - Ground via optimization on substrate for high speed signal transmission

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Jing Zhou ; Wei Gao ; Baoxia Li ; Qidong Wang ; Xia Zhang ; Liqiang Cao ; Lixi Wan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 567 - 570
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5583793
Regular:

Via design is an important factor for signal integrity. Usually there are lots of ground vias on the PCB board at high frequencies. Transmission lines need to turn or change layer, which... View More

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