IEEE - Institute of Electrical and Electronics Engineers, Inc. - Analytical (“mathematical”) modeling of the dynamic response of a printed circuit board (PCB) to an impact load

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Suhir, E.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 480 - 488
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5583788
Regular:

Based on the developed analytical ("mathematical") stress model, we evaluate the dynamic response of a "flexible-and-heavy" square simply supported printed circuit board (PCB) to an impact... View More

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