IEEE - Institute of Electrical and Electronics Engineers, Inc. - High frequency resistance calculation and modeling of Through Silicon Vias

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Yuanjun Liang ; Ye Li
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 563 - 566
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5583787
Regular:

Through Silicon Via (TSV) is the primary interconnection technology in three dimensional integrated circuits (3DICs). The high frequency resistance of the TSV needs to be calculated and modeled.... View More

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