IEEE - Institute of Electrical and Electronics Engineers, Inc. - Characteristics of high frequency and high density through silicon vias (TSVs)

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Wang Qidong ; Guo Xueping ; Wang Huijuan ; Dai Fengwei ; Zhou Jing ; Gao Wei ; Li Jun ; Cao Liqiang ; Wan Lixi ; Guidotti, D.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 552 - 555
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5583784
Regular:

TSV has now been a hotspot of the industry for years. Comparing with the wire-bonding, the technology populated in the last decade, Through Silicon Via (TSV) has merits of shorter wiring route,... View More

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