IEEE - Institute of Electrical and Electronics Engineers, Inc. - Carbon nanotube enhanced thermally and electrically conductive adhesive for advanced packaging

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Xinhe Tang ; Reiter, W. ; Meyer, A. ; Tse, K.K.C. ; Hammel, E.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 438 - 441
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582881
Regular:

A comprehensive investigation has been carried out to develop nano-adhesive by studying the influences of post-treatment of carbon nanotue (CNT), dispersing parameter, CNT content and matrix on... View More

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