IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effects of adhesive material on the output characteristics of pressure sensor

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Zongyang Zhang ; Zhimin Wan ; Chaojun Liu ; Gang Cao ; Yun Lu ; Sheng Liu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 657 - 660
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582879
Regular:

The attachment of the silicon piezoresistive pressure sensor die to the substrate is one of the most critical steps in the production of highly accurate pressure sensor. In this paper, single... View More

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