IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effects of Joule heating on the impact behavior of lead-free Sn-based solder joints

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Sihan Liu ; Fang Liu ; Zhe Li ; Guangchen Xu ; Fu Guo
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 652 - 656
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582878
Regular:

Charpy impact behaviors of eutectic SnBi solder joints with and without presence of Joule heating effect were investigated by employing a pendulum-type impact tester. The temperature rise induced... View More

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