IEEE - Institute of Electrical and Electronics Engineers, Inc. - Low alkaline solution to deposit electroless Ni-Zn-P film on al pad

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Fong-Cheng Tai ; Hsiu-Min Lin ; Jenq-Gong Duh ; Liang-liang Li
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 429 - 432
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582872
Regular:

The amorphous electroless NiP film is used as under-bump metallization (UBM) structure of chip pad or surface finish of IC substrate (or printed circuit board) to join with different solders on... View More

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