IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability metrics for IGBT power modules

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Newcombe, D.R. ; Chamund, D. ; Bailey, C. ; Lu, H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 670 - 674
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582869
Regular:

In the field of IGBT modules, there is currently a plethora of new packaging materials being developed with a view to increased "reliability". Whilst this approach is often essential to meet the... View More

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