IEEE - Institute of Electrical and Electronics Engineers, Inc. - Microstructural evolution of Sn-9Zn-3Bi and Sn-9Zn-3Bi-0.3Cr solder under high-temperature and high-humidity conditions

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Jing Hu ; Xi Chen ; Anmin Hu ; Ming Li ; Dali Mao
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 413 - 417
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582867
Regular:

The microstructual stability of Sn-8Zn-3Bi/Cu and Sn-8Zn-3Bi-0.3Cr/Cu joints has been investigated under 85 °C temperature and 85% humidity conditions as a function of exposure time. The evolution... View More

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