IEEE - Institute of Electrical and Electronics Engineers, Inc. - A system-level equivalent circuit method for the electrical performance modeling of electronic packages

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Xing-Chang Wei ; Er-Ping Li
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 683 - 686
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582866
Regular:

In this paper, we propose a system-level field-circuit method for the signal integrity and power integrity simulation of power distribution networks inside the electronic packages. The... View More

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