IEEE - Institute of Electrical and Electronics Engineers, Inc. - Simulation of thermal stresses in 2N gold wires evaluated for PBGA application

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Weidong Huang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 679 - 682
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582864
Regular:

Simulation of thermal stresses in gold wires was rarely reported in previous days due to the difficulties in FE model building. In this study, the 3D modeling was performed to evaluate the thermal... View More

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