IEEE - Institute of Electrical and Electronics Engineers, Inc. - A study on the application of soldering flux on the solder balls of BGA packages

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Yu Wang ; Liqiang Cao
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 405 - 409
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582858
Regular:

The growing demand for microelectronics packaging solutions with increased I/O density and smaller size has made BGA packages widespread used in modern microelectronic products. During the surface... View More

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