IEEE - Institute of Electrical and Electronics Engineers, Inc. - Microstructure and solderability of Sn-3.5Ag-0.5Cu-xBi-ySb solders

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Sheng Lu ; Zhixia Zheng ; Jing Chen ; Fei Luo
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 410 - 412
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582854
Regular:

Lead-free solders were prepared by adding a small quantity of Bi, Sb element into Sn-3.5Ag-0.5Cu alloy. By means of OM, SEM,EDS, DTA and solderability test, effects of Bi and Sb elements on... View More

Advertisement