IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal design considerations in system level testing of electronic devices

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Zhang, H.Y. ; Tarin, M. ; Kumar, R.K. ; Mui, Y.C.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 718 - 723
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582848
Regular:

System level testing requires precise thermal control of electronic devices under dynamic loads at prescribed test temperatures. Thermal design considerations for all the thermal components,... View More

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