IEEE - Institute of Electrical and Electronics Engineers, Inc. - An analysis of local deformation of SnAgCu solder joint using digital image correlation

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Nobuyuki Shishido, N. ; Kanno, T. ; Kawahara, S. ; Ikeda, T. ; Noriyuki Miyazaki, N. ; Hua Lu ; Bailey, C. ; Thomas, O. ; Di Maio, D. ; Hunt, C.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 376 - 381
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582845
Regular:

The changeover from eutectic Sn-Pb solders to lead-free solders has been driven by environmental concerns and market accessibility in the last few years. Though a number of creep constitutive laws... View More

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