IEEE - Institute of Electrical and Electronics Engineers, Inc. - Microwave performance and sensitivity solutions for an inline coupling RF MEMS power sensor packaging

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Zhiqiang Zhang ; Xiaoping Liao
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 730 - 732
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582843
Regular:

In order to minimize the effect of packaging on the microwave performance and the sensitivity at X-band, a packaging theory of an inline coupling RF MEMS power sensor is proposed in this paper.... View More

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