IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability analysis on electromigration and electro-thermo-mechanical for Sn4.0Ag0.5Cu solder ball

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Hsiang-Chen Hsu ; Jie-Rong Lu ; Yue-Min Wan ; Shen-Li Fu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 724 - 729
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582842
Regular:

An electro-thermo coupling finite element model for lead free Sn4.0Ag0.5Cu (SAC405) solder ball is developed to investigate the electromigration and electro-thermo-mechanical effects on... View More

Advertisement