IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal analysis of 3D packaging with a simplified thermal resistance network model and finite element simulation

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Zhaohui Chen ; Xiaobing Luo ; Sheng Liu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 737 - 741
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582840
Regular:

Analytical solution is established to calculate equivalent thermal resistances of the through silicon via (TSV) structure in both z direction and x y directions and is verified by the finite... View More

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