IEEE - Institute of Electrical and Electronics Engineers, Inc. - Improved modeling for solder joint geometry and self-alignment in flip chip bonding

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Chenxi Wang ; Chunqing Wang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 747 - 752
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582837
Regular:

Prediction of solder joint geometry is one of key steps for achieving accurate alignment in optoelectronic packaging. An improved modeling is developed to predict the solder joint geometry. The... View More

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