IEEE - Institute of Electrical and Electronics Engineers, Inc. - Study on parallel scheduling of LED dies measurement and grading

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Tao Wu ; Bin Li ; Longwen Wang ; Kanghua Lin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,426 - 1,430
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582834
Regular:

The light-emitting diode (LED) is the world's most efficient light source being mass produced today. However, the packaging cost is relatively high, which has been the main factor restricting... View More

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