IEEE - Institute of Electrical and Electronics Engineers, Inc. - Study on adhesive reliability of low-temperature sintered high power LED modules

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Xin Li ; Xu Chen ; Dun-Ji Yu ; Guo-Quan Lu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,371 - 1,376
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582818
Regular:

Low temperature sintered nano-silver paste becomes a potential alternative in green electrical packaging because of its higher thermal and electrical conductivity than conventional solders. It can... View More

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