IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal analysis and comparison of heat dissipation methods on high-power LEDs

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Lei Liu ; Zhang, G.Q. ; Daoguo Yang ; Kailin Pan ; Hong Zhong ; Fengze Hou
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,366 - 1,370
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582816
Regular:

Nowadays LEDs (Light Emitting Diodes) are widely used in many fields. As the fourth generation of lighting sources, LEDs have the advantages of long lifetime, power saving and... View More

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