IEEE - Institute of Electrical and Electronics Engineers, Inc. - Experimental research of micro-channel cooler

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Li Zongshuo ; Wang Xiaojing ; Wang Dianxiao ; Wang Jia
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,355 - 1,358
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582812
Regular:

With the continuously decreasing size and constantly increasing integration of IC chips, the heat flux is increasing rapidly. Many enhancements are proposed in order to increase the thermal... View More

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