IEEE - Institute of Electrical and Electronics Engineers, Inc. - Piezoresistive pressure sensors based on system in packaging technology of MEMS

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Xiong Shi ; Jian Xu ; Zhiyin Gan ; Sheng Liu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,337 - 1,341
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582806
Regular:

The die of piezoresistance based pressure sensor and its driving circuits has been integrated into one printed circuit board which is specially designed. Then the whole PCB is packaged into a... View More

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