IEEE - Institute of Electrical and Electronics Engineers, Inc. - Heat transfer in plane microchannel under a thermal asymmetry boundary

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Huanling Liu ; Xiaodong Shao ; Wenchao Tian
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,331 - 1,336
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582804
Regular:

The laminar forced convective heat transfer in plane microchannel has been investigated numerically. The parallel plates making the boundaries are kept at constant, but different temperatures,... View More

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