IEEE - Institute of Electrical and Electronics Engineers, Inc. - Design and fabrication of 2.45G miniaturized band pass filter by LTCC technology

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Daming Chen ; Yingli Liu ; Yuanxun Li ; Wenguo Zhong ; Dafu Lu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,321 - 1,323
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582800
Regular:

With the rapid development of wireless communication systems and personal consumer electronics, it is intensely necessary for RF-products to be more and more multifunctional and miniaturized. The... View More

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