IEEE - Institute of Electrical and Electronics Engineers, Inc. - Metal surface cleanliness and its improvement on bonding

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Ying-Hui Wang ; Suga, T.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,317 - 1,320
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582798
Regular:

The cleanliness of Au, Cu and Sn surfaces by Ar fast atom beam (FAB) and Ar-plasma treatment was investigated using X-ray photoelectron spectroscopy (XPS). Oxides and organic residues can be... View More

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