IEEE - Institute of Electrical and Electronics Engineers, Inc. - Experimental analysis of propagation of the delamination in Flex-PCBs subjected to thermal cycling loading

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Arruda, L. ; Ferreira, W. ; Andolfatto, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,314 - 1,316
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582797
Regular:

In this work it will be discussed a non-destructive method based on scanning acoustic microscopy (SAM) investigation to identify the delamination failure. The samples were subject to shock test... View More

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