IEEE - Institute of Electrical and Electronics Engineers, Inc. - Theoretical analysis and simulation of micromachined THz waveguide embedded in LTCC multi-layer packaging substrate for high throughput data exchange backbone and vacuum electronic devices applications

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Yang Zhang ; Min Miao ; Bo Han ; Yuduo Wang ; Zhensong Li
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,308 - 1,313
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582795
Regular:

Micromachined waveguides embedded in LTCC (Low Temperature Co-fired Ceramic) multi-layer packaging substrate are excellent candidates for vacuum microelectronic devices in submillimeter wave or... View More

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