IEEE - Institute of Electrical and Electronics Engineers, Inc. - Millimeter-wave main memory-to-processor data bus

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Guidotti, D. ; Hung-Chang Chien ; Shu-Hao Fan ; Chowdhury, A. ; Tianyi Guo ; Gee-Kung Chang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,280 - 1,287
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582788
Regular:

The mainstreaming of chip multiprocessor (CMP) architectures exact a profound impact on valuable resources, for example, L3 cache capacity, off-chip bandwidth and on-board main memory capacity.... View More

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