IEEE - Institute of Electrical and Electronics Engineers, Inc. - A verification of application specific component qualification

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Challa, V. ; Pecht, M. ; Shilin Liu ; Qiang Yu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,265 - 1,268
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582783
Regular:

Semiconductor component manufacturers supply to different product manufacturers in a wide range of market segments, for different end use applications. The goal of electronic component... View More

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