IEEE - Institute of Electrical and Electronics Engineers, Inc. - Advanced Deformation Measurements for electronic products at manufacturing & operating temperatures

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Schwarz, B.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,242 - 1,245
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582776
Regular:

Deformation Measurements under thermo-mechanical load are quick and useful tool to increase the reliability of electronic products and to verify Finite Element Models (FEM). Two Examples... View More

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