IEEE - Institute of Electrical and Electronics Engineers, Inc. - Design-for-Reliability applications in concurrent engineering practices for electronic package development from system manufacturers' perspectives

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Liyu Yang ; Rui Niu ; Jingsong Xie ; Bin Qian ; Baishi Song ; Qingan Rong
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,230 - 1,241
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582774
Regular:

In today's electronic package development cycle, activities are managed by multiple participants in the supply chain which might have different quality and reliability impacts to the end product.... View More

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