IEEE - Institute of Electrical and Electronics Engineers, Inc. - Investigation on PCB pad strength

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Cai, M. ; Xie, D.J. ; Zhang, Z. ; Hu, B. ; Su, X.X. ; Tao, Y. ; Wu, B.Y.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,226 - 1,229
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582773
Regular:

In this paper, a pin pull test is introduced as an effective way to assess the PCB pad strength. The pad strength is evaluated by different level of strain, pad type, PCB life phase and... View More

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