IEEE - Institute of Electrical and Electronics Engineers, Inc. - The effect of drilling parameters on the wicking in high density PCB processing

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Liquan Wang ; Fengshun Wu ; Longzao Zhou ; Dong Liu ; Tuanfen Gao ; Xuefei Jiang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,214 - 1,217
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582768
Regular:

Wicking is one of the important factors that cause the internal short of Printed Circuit Board (PCB), and directly restrict the pitch of holes. In this paper, orthogonal experimental design method... View More

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