IEEE - Institute of Electrical and Electronics Engineers, Inc. - The influence of package thermal resistance on the EMP injection damage effect of transistors

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Ren Xingrong ; Chai Changchun ; Ma Zhenyang ; Yang Yintang ; Wang Jing ; Ren Lihua
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,210 - 1,213
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582767
Regular:

With the thermal effects of substrate and package in mind, electrothermal simulations are performed on the transient response of transistors under the injection of electromagnetic pulses by... View More

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