IEEE - Institute of Electrical and Electronics Engineers, Inc. - Investigation of package warpage effect on TC solder joint reliability

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Jianhui Wang ; Long Wen ; Jianwei Zhou ; Jaisung Lee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,201 - 1,205
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582764
Regular:

Thermal fatigue of solder joints is critical to electronic package performance and life consideration. Failure caused by device warpage (WPG) problems is a major challenge with demands for... View More

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