IEEE - Institute of Electrical and Electronics Engineers, Inc. - A package method for reducing bus crosstalk in full chip ESD protection circuit

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Zhang Bing ; Chai Chang-chun ; Yang Yin-Tang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,183 - 1,185
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582758
Regular:

In this paper, a package method that can be applied to the full-chip electrostatic discharge (ESD) protection circuit is presented. By connecting ESD protection circuit bus, power clamp circuit... View More

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