IEEE - Institute of Electrical and Electronics Engineers, Inc. - Comparison investigation of thermal fatigue and mechanical fatigue behavior of board level solder joint

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Jian Lin ; Yongping Lei ; Zhongwei Wu ; LanLi Yin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,179 - 1,182
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582756
Regular:

The thermal fatigue and mechanical fatigue are the two main failure modes for board level solder joint in SMT. The comparison investigation of thermal fatigue and mechanical fatigue behavior of... View More

Advertisement