IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability study of stretchable electronics interconnect by simulation

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Quayle Chen ; Anping Zhao ; Leon Xu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,174 - 1,178
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582755
Regular:

In this paper, the stretchable interconnect is taken as the research object and its reliability has been analyzed by simulations. Polydimethylsiloxanes (PDMS), as a hyper elastic material,... View More

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