IEEE - Institute of Electrical and Electronics Engineers, Inc. - Failure analysis and test for high speed packaging, HDMI packaging and QSFP packaging

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Haifei Xiang ; Jian Song ; Fengman liu ; Wei Gao ; Baoxia Li ; Lixi Wan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,158 - 1,161
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582750
Regular:

In this paper we present several failures in optical packaging. Then we analysis the main reasons of these failures. Next, we suggest ways to avoid similar failures. Several simple examinations... View More

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