IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effects of Zn, Ge doping on electrochemical migration, oxidation characteristics and corrosion behavior of lead-free Sn-3.0Ag-0.5Cu solder for electronic packaging

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Author(s): Hua, L. ; Hou, H.N. ; Zhang, H.Q. ; Wu, T. ; Deng, Y.H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2010
Conference Location: Xi'an, China, China
Conference Date: 16 August 2010
Page(s): 1,151 - 1,157
ISBN (CD): 978-1-4244-8141-5
ISBN (Electronic): 978-1-4244-8142-2
ISBN (Paper): 978-1-4244-8140-8
DOI: 10.1109/ICEPT.2010.5582749
Regular:

Due to lead-free pressure, Sn-Ag-Cu solder is regarded as the potential substitute. However, higher melting point and faintish soldering restrict its wide application. Metal or rare earth metal... View More

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